FLUID SUPPLY DEVICE AND WAFER CLEANING APPARATUS USING THE SAME

    公开(公告)号:US20240058845A1

    公开(公告)日:2024-02-22

    申请号:US18231720

    申请日:2023-08-08

    CPC classification number: B08B3/02 B08B13/00 B08B3/08 H01L21/67023

    Abstract: A fluid supply device and a wafer cleaning apparatus using the same are proposed. The fluid supply device is improved to minimize occurrence of particles generated in an operational process in order to reduce contamination of a wafer. The fluid supply device includes a supply tube connected to a supply tank storing a liquid chemical and a supply valve, a drain tube connected to the supply tube by a branch tube and a drain valve, a fluid tank, a provision tube connected to the supply tube via the branch tube to provide the liquid chemical into the fluid tank, a supply valve, a tank drain tube connected to the fluid tank to drain a liquid chemical in the fluid tank, and a tank drain valve, and a controller configured to control opening and closing of each of the valves and supply of the liquid chemical supplying through the supply tube.

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