公开(公告)号：US20210159092A1

公开(公告)日：2021-05-27

申请号：US16951718

申请日：2020-11-18

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Sun Mi KIM ,  Ji Su HONG ,  Kuk Saeng KIM ,  Cheng Bin CUI ,  Pil Kyun HEO

IPC: H01L21/67 ,  B08B3/04

Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.

公开(公告)号：US20240058845A1

公开(公告)日：2024-02-22

申请号：US18231720

申请日：2023-08-08

Applicant: SEMES CO., LTD.

Inventor： Dong Hee SON ,  Seong Soo LEE ,  Jeong Bin LEE ,  Sun Mi KIM

IPC: B08B3/02 ,  B08B13/00 ,  B08B3/08

CPC classification number: B08B3/02 ,  B08B13/00 ,  B08B3/08 ,  H01L21/67023

Abstract: A fluid supply device and a wafer cleaning apparatus using the same are proposed. The fluid supply device is improved to minimize occurrence of particles generated in an operational process in order to reduce contamination of a wafer. The fluid supply device includes a supply tube connected to a supply tank storing a liquid chemical and a supply valve, a drain tube connected to the supply tube by a branch tube and a drain valve, a fluid tank, a provision tube connected to the supply tube via the branch tube to provide the liquid chemical into the fluid tank, a supply valve, a tank drain tube connected to the fluid tank to drain a liquid chemical in the fluid tank, and a tank drain valve, and a controller configured to control opening and closing of each of the valves and supply of the liquid chemical supplying through the supply tube.

公开(公告)号：US20230298915A1

公开(公告)日：2023-09-21

申请号：US18202396

申请日：2023-05-26

Applicant: SEMES CO., LTD.

Inventor： Sun Mi KIM ,  Jisu HONG ,  Moonsik CHOI ,  Oh Jin KWON

IPC: H01L21/67 ,  H01L21/027

CPC classification number: H01L21/6715 ,  H01L21/0273 ,  H01L21/67051

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

公开(公告)号：US20200185236A1

公开(公告)日：2020-06-11

申请号：US16705065

申请日：2019-12-05

Applicant: SEMES CO., LTD.

Inventor： Sun Mi KIM ,  Jisu HONG ,  Moonsik CHOI ,  Oh Jin KWON

IPC: H01L21/67 ,  H01L21/027

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

公开(公告)号：US20230343610A1

公开(公告)日：2023-10-26

申请号：US18215128

申请日：2023-06-27

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Sun Mi KIM ,  Ji Su HONG ,  Kuk Saeng KIM ,  Cheng Bin CUI ,  Pil Kyun HEO

IPC: H01L21/67 ,  B08B3/04

CPC classification number: H01L21/6708 ,  B08B3/041 ,  H01L21/67253

Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.