公开(公告)号：US20230063546A1

公开(公告)日：2023-03-02

申请号：US17864613

申请日：2022-07-14

Applicant: SEMES CO., LTD.

Inventor： Jae Yoon SHIN ,  Kee Woong KIM

IPC: H01L21/67

Abstract: A substrate processing apparatus capable of minimizing process defects by controlling mist in a processing bath is provided. The substrate treating apparatus comprises a first processing bath and a second processing bath disposed adjacent to each other in a first direction, a first partition wall disposed between the first processing bath and the second processing bath and having an entrance, through which a substrate passes, a transfer unit installed in the first processing bath and the second processing bath and for moving the substrate, a chemical solution supply unit installed in the first processing bath and for providing a chemical solution to the substrate, and a first exhaust unit disposed between the first processing bath and the second processing bath, connected to the first partition wall, comprising a plurality of exhaust holes disposed along a second direction different from the first direction, and for exhausting mist in the first processing bath.