公开(公告)号：US20240239099A1

公开(公告)日：2024-07-18

申请号：US18411107

申请日：2024-01-12

Applicant: SEMES CO., LTD.

Inventor： Solmin PARK ,  Hyunmin LEE ,  Junho KIM ,  Sujin KIM

IPC: B41J2/045

CPC classification number: B41J2/04561 ,  B41J2/0451 ,  B41J2/0457 ,  B41J2/04581 ,  B41J2/04588

Abstract: A substrate processing method includes determining a first impact of an ink droplet ejected toward a substrate moving at a first speed, determining a second impact of an ink droplet ejected toward the substrate moving at a second speed, determining a reference ejection speed based on the first impact and the second impact, determining a plurality of third impacts of a plurality of ink droplets respectively ejected from a plurality of nozzles toward the substrate moving at a third speed, determining an ink ejection speed of each of the plurality of nozzles based on the first impact and the plurality of third impacts, and comparing the ink ejection speeds of the plurality of nozzles with the reference ejection speed and determining whether ink ejection performance of the plurality of nozzles is abnormal.