公开(公告)号：US20240198364A1

公开(公告)日：2024-06-20

申请号：US18479884

申请日：2023-10-03

Applicant: SEMES CO., LTD.

Inventor： Sang Hu HAN ,  Oh Jin KWON ,  Yong PARK

IPC: B05B1/14 ,  B05B13/02 ,  B29C45/00 ,  B29C45/17

CPC classification number: B05B1/14 ,  B05B13/0278 ,  B29C45/0055 ,  B29C45/17 ,  B29L2023/22

Abstract: The present disclosure provides a back nozzle, a substrate treating apparatus, and a method for manufacturing a back nozzle. The back nozzle according to an embodiment of the present disclosure includes a base module formed with a central nozzle pipe; and a plurality of side modules installed along the side portion of the base module, some of which have peripheral nozzle pipes formed thereon.

公开(公告)号：US20240222177A1

公开(公告)日：2024-07-04

申请号：US18393850

申请日：2023-12-22

Applicant: SEMES CO., LTD.

Inventor： Yong PARK

IPC: H01L21/68 ,  H01L21/683

CPC classification number: H01L21/68 ,  H01L21/6838

Abstract: A substrate support apparatus includes a first chuck configured to support a substrate by contacting a bottom surface of the substrate, a second chuck configured to horizontally move the substrate by contacting a side surface of the substrate, wherein the second chuck includes a second chuck body coupled to the first chuck, a plurality of protruding pins vertically protruding from an outer portion of a top surface of the second chuck body, and an alignment pin vertically protruding from a top surface of each of the plurality of protruding pins, wherein the plurality of protruding pins are located at a same horizontal distance from a center of the first chuck.