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    BUBBLE REMOVING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
    1.
    发明申请
    BUBBLE REMOVING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME 审中-公开
    泡沫拆卸单元和底板处理装置，包括它们

    公开(公告)号：US20170001127A1

    公开(公告)日：2017-01-05

    申请号：US15195225

    申请日：2016-06-28

    Applicant: Semes Co., Ltd.

    Inventor： Jaehyeok YU ,  Jae-Youl KIM ,  Oh Jin KWON

    IPC: B01D19/00

    CPC classification number: B01D19/0057 ,  B01D19/0052

    Abstract: A bubble removing unit is disclosed including a body having an inner space, through which a liquid flows, in an interior thereof, a liquid introducing pipe through which the liquid is supplied to the body, a liquid discharging pipe through which the liquid, from which bubbles are removed, is discharged from the body, a bubble discharging pipe through which the bubbles are discharged from the inner space, and a rod-shaped bar situated in the inner space and a length of which extends in a lengthwise direction of the body, wherein a variable cross-section part situated between the liquid introducing pipe and the liquid discharging pipe and a cross-section of which varies along the lengthwise direction of the body is provided in the inner space of the body.

    Abstract translation: 一种气泡去除单元，其包括一个主体，该主体具有内部空间，液体在其内部流动，液体引入管通过该液体引入管，液体通过该导入管供应到主体;液体排出管， 从体内排出气泡，从内部空间排出气泡的气泡排出管，位于内部空间中的长度方向延伸的杆状杆， 其特征在于，在所述主体的内部空间中设置有位于所述液体导入管和所述排液管之间的横截面变化的横截面，沿着所述主体的长度方向变化的横截面。

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    4.
    发明申请
    APPARATUS AND METHOD FOR TREATING SUBSTRATE 有权

    公开(公告)号：US20210111042A1

    公开(公告)日：2021-04-15

    申请号：US17132008

    申请日：2020-12-23

    Applicant: SEMES CO., LTD.

    Inventor： Boong KIM ,  Oh Jin KWON ,  Sungho JANG ,  Joo Jib PARK

    IPC: H01L21/67 ,  F26B25/14 ,  H01L21/677 ,  H01L21/687

    Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    7.
    发明申请
    APPARATUS AND METHOD FOR TREATING SUBSTRATE 审中-公开

    公开(公告)号：US20200185236A1

    公开(公告)日：2020-06-11

    申请号：US16705065

    申请日：2019-12-05

    Applicant: SEMES CO., LTD.

    Inventor： Sun Mi KIM ,  Jisu HONG ,  Moonsik CHOI ,  Oh Jin KWON

    IPC: H01L21/67 ,  H01L21/027

    Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

    APPARATUS FOR TREATING SUBSTRATE
    8.
    发明申请
    APPARATUS FOR TREATING SUBSTRATE 审中-公开
    用于处理基板的装置

    公开(公告)号：US20160013079A1

    公开(公告)日：2016-01-14

    申请号：US14747704

    申请日：2015-06-23

    Applicant: Semes Co., Ltd.

    Inventor： Jung Bong CHOI ,  Seong Soo KIM ,  Chan-Young HEO ,  Oh Jin KWON

    IPC: H01L21/67 ,  H01L21/687

    CPC classification number: H01L21/6708 ,  H01L21/67051 ,  H01L21/67115 ,  H01L21/67248

    Abstract: A substrate treating apparatus is provided which includes a treating container of which a top end is opened, a substrate support unit placed in a treating container to support a substrate, a treatment solution supply unit supplying a treatment solution to a substrate put on the support unit, and a heating unit placed in the substrate support unit to heat the substrate. The heating unit includes a heating element and a reflection element reflecting a heat from the heating element upward.

    Abstract translation: 提供了一种基板处理装置，其包括顶端打开的处理容器，放置在处理容器中以支撑基板的基板支撑单元，将处理溶液供给到放置在支撑单元上的基板的处理溶液供给单元 以及放置在基板支撑单元中以加热基板的加热单元。 加热单元包括加热元件和从加热元件向上反射热量的反射元件。

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    9.
    发明申请
    APPARATUS AND METHOD FOR TREATING SUBSTRATE 有权
    用于处理基板的装置和方法

    公开(公告)号：US20160013080A1

    公开(公告)日：2016-01-14

    申请号：US14749010

    申请日：2015-06-24

    Applicant: Semes Co., Ltd.

    Inventor： Tae Keun KIM ,  Oh Jin KWON ,  Ki Hoon CHOI

    IPC: H01L21/67 ,  B08B3/10 ,  B08B3/02

    CPC classification number: B08B3/10 ,  B08B3/12 ,  B08B7/028 ,  H01L21/67017 ,  H01L21/67051

    Abstract: Embodiments of the inventive concepts provide an apparatus and a method for treating a substrate. The apparatus includes a substrate support unit supporting the substrate, and a liquid supply unit supplying a treatment solution to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle discharging the treatment solution to the substrate, a liquid supply line supplying the treatment solution to the nozzle, a mixing member installed on the liquid supply line, a mixing space formed within the mixing member, and a gas supply line connected to the mixing member to supply a gas into the mixing space. The mixing member includes a body within which the mixing space is formed, and an inflow port combined with the body such that the gas supplied through the inflow port is mixed with the treatment solution in the mixing space to form nano-sized bubbles.

    Abstract translation: 本发明构思的实施例提供了一种用于处理基底的装置和方法。 该装置包括支撑基板的基板支撑单元和向由基板支撑单元支撑的基板供应处理溶液的液体供应单元。 液体供给单元包括将处理液排出到基板的喷嘴，向喷嘴供给处理液的液体供给管线，安装在液体供给管线上的混合部件，形成在混合部件内的混合空间和气体供给部 线路连接到混合构件以将气体供应到混合空间中。 混合构件包括形成混合空间的主体和与主体结合的流入口，使得通过流入口供应的气体与混合空间中的处理溶液混合以形成纳米级气泡。

    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
    10.
    发明申请
    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号：US20130318815A1

    公开(公告)日：2013-12-05

    申请号：US13905754

    申请日：2013-05-30

    Applicant: SEMES CO., LTD.

    Inventor： KiBong KIM ,  Boong KIM ,  Gil Hun SONG ,  Oh Jin KWON

    IPC: F26B3/02 ,  F26B21/12

    CPC classification number: H01L21/02101 ,  B08B7/0021 ,  F26B21/12 ,  F26B21/14 ,  H01L21/67017 ,  H01L21/67034 ,  H01L21/67051

    Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.

    Abstract translation: 提供了一种使用超临界流体处理基板的装置。 基板处理装置包括壳体，设置在壳体内以支撑基板的支撑构件，超临界流体供应单元，超临界流体被储存在该超临界流体供应单元中，供应管将超临界流体供应单元连接到壳体以调节 从超临界流体供给单元供给到壳体中的超临​​界流体和从供给管分支以排出残留在供给管中的超临界流体的通气管。 打开或关闭排气管的切换阀设置在排气管中。

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