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公开(公告)号:US20240421261A1
公开(公告)日:2024-12-19
申请号:US18722165
申请日:2022-11-17
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Se Hee OH , Kyoung Wan KIM , Hae Yu KIM
IPC: H01L33/46
Abstract: A light-emitting diode according to an embodiment comprises: a substrate; a first conductive-type semiconductor layer disposed on the substrate; a mesa disposed on the first conductive-type semiconductor layer and including an active layer and a second conductive-type semiconductor layer; an ohmic contact layer disposed on the second conductive-type semiconductor layer and formed by islands which are spaced apart from each other; a dielectric layer covering the ohmic contact layer and having openings through which the respective islands are exposed; a metal reflective layer covering the dielectric layer and electrically connected to the islands through the openings of the dielectric layer; a lower insulating layer covering the metal reflective layer and having an opening through which the metal reflective layer is exposed; and first and second bump pads disposed on the lower insulating layer and electrically connected to the first and second conductive-type semiconductor layers, respectively.