公开(公告)号：US20230420288A1

公开(公告)日：2023-12-28

申请号：US18212395

申请日：2023-06-21

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Takahiro HAMADA ,  Osamu Yamazaki

IPC: H01L21/687 ,  B23Q1/03

CPC classification number: H01L21/68728 ,  B23Q1/03

Abstract: According to one embodiment, a substrate processing apparatus includes a rotating table configured to rotate a substrate and a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate, wherein each fixing member includes a curved surface on a side that abuts the substrate, a reduced portion formed to be connected to an end of the curved surface and having a width which is continuously reduced in the first direction from a boundary with the curved surface, a first sloping surface formed on a top portion to slope downwards in the first direction, and a support portion formed on the curved surface and configured to support the substrate such that a top surface of the top portion is flush with an upper surface of the substrate in a state where the substrate is grasped.