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公开(公告)号:US09964358B2
公开(公告)日:2018-05-08
申请号:US15141946
申请日:2016-04-29
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor: Jun Matsushita , Takashi Miyamoto , Konosuke Hayashi , Osamu Yamazaki
CPC classification number: F26B3/30 , F26B5/08 , H01L21/67115
Abstract: The substrate processing unit 1 comprises the rotating table 31 configured to hold substrate W, the processing chamber 37 which accommodates the rotating table 31, a lamp 61 is provided above the processing chamber 37 and configured to heat the surface of substrate W, the lamp chamber 60 which accommodates that lamp 61, a transmission window 62 disposed below the lamp chamber 60, and a plurality of nozzle 64 which supply cooling fluid G to the transmission window 62. Then the substrate processing unit 1 can suppress generating of a water mark or pattern collapse, and can perform good substrate processing.
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公开(公告)号:US20230420288A1
公开(公告)日:2023-12-28
申请号:US18212395
申请日:2023-06-21
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor: Takahiro HAMADA , Osamu Yamazaki
IPC: H01L21/687 , B23Q1/03
CPC classification number: H01L21/68728 , B23Q1/03
Abstract: According to one embodiment, a substrate processing apparatus includes a rotating table configured to rotate a substrate and a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate, wherein each fixing member includes a curved surface on a side that abuts the substrate, a reduced portion formed to be connected to an end of the curved surface and having a width which is continuously reduced in the first direction from a boundary with the curved surface, a first sloping surface formed on a top portion to slope downwards in the first direction, and a support portion formed on the curved surface and configured to support the substrate such that a top surface of the top portion is flush with an upper surface of the substrate in a state where the substrate is grasped.
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