公开(公告)号：US12051641B2

公开(公告)日：2024-07-30

申请号：US17527434

申请日：2021-11-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yi-Min Fu ,  Chi-Ching Ho ,  Cheng-Yu Kang ,  Yu-Po Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/367 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/73 ,  H01L2224/73204 ,  H01L2924/3511

Abstract: Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.

公开(公告)号：US20230111192A1

公开(公告)日：2023-04-13

申请号：US17527434

申请日：2021-11-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yi-Min Fu ,  Chi-Ching Ho ,  Cheng-Yu Kang ,  Yu-Po Wang

IPC: H01L23/498 ,  H01L23/367 ,  H01L21/48

Abstract: Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.