公开(公告)号：US10270413B2

公开(公告)日：2019-04-23

申请号：US14782548

申请日：2014-03-21

Applicant: SOITEC

Inventor： Christophe Zinke ,  Eric Desbonnets

IPC: H01L41/22 ,  H03H3/08 ,  H03H9/25

Abstract: This disclosure relates to a method of fabrication of a surface acoustic wave device comprising the step (a) of providing a piezoelectric structure, the step (b) of providing a dielectric structure, wherein the step (b) comprises a step (b1) of metalizing the dielectric structure, and the method further comprising the step (c) of bonding the metalized dielectric structure to the piezoelectric structure.

公开(公告)号：US20160065162A1

公开(公告)日：2016-03-03

申请号：US14782548

申请日：2014-03-21

Applicant: SOITEC

Inventor： Christophe Zinke ,  Eric Desbonnets

IPC: H03H3/08 ,  H03H9/25

CPC classification number: H03H3/08 ,  H03H9/25

Abstract: This disclosure relates to a method of fabrication of a surface acoustic wave device comprising the step (a) of providing a piezoelectric structure, the step (b) of providing a dielectric structure, wherein the step (b) comprises a step (b1) of metalizing the dielectric structure, and the method further comprising the step (c) of bonding the metalized dielectric structure to the piezoelectric structure.

Abstract translation: 本公开涉及一种制造声表面波器件的方法，包括提供压电结构的步骤（a），提供电介质结构的步骤（b），其中步骤（b）包括步骤（b1） 金属化电介质结构，并且该方法还包括将金属化电介质结构接合到压电结构的步骤（c）。