公开(公告)号：US20140106529A1

公开(公告)日：2014-04-17

申请号：US14051174

申请日：2013-10-10

Applicant: STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS, INC.

Inventor： Pierre Morin ,  Remi Beneyton

IPC: H01L29/66

CPC classification number: H01L29/665 ,  H01L21/28518 ,  H01L29/41791 ,  H01L29/66795 ,  H01L29/7845

Abstract: A thermal annealing flow process includes the steps of: depositing a metal or metal alloy on a silicon semiconductor structure, performing a first annealing of a rapid thermal anneal (RTA) type to produce a metal rich phase in a portion of the silicon semiconductor structure, removing unreacted metal or metal alloy and performing a second annealing as a millisecond annealing at a temperature that is below a melt temperature of the silicon material present in the silicon semiconductor structure.

Abstract translation: 热退火流程包括以下步骤：在硅半导体结构上沉积金属或金属合金，执行快速热退火（RTA）型的第一退火以在硅半导体结构的一部分中产生富金相， 去除未反应的金属或金属合金，并在低于硅半导体结构中存在的硅材料的熔融温度的温度下进行第二退火作为毫秒退火。