公开(公告)号：US20190356390A1

公开(公告)日：2019-11-21

申请号：US16409723

申请日：2019-05-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Alexandre COULLOMB ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: H04B10/40 ,  H04B10/50 ,  H04B10/69 ,  H01L31/0203 ,  H01L25/04

Abstract: An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.

公开(公告)号：US20210202781A1

公开(公告)日：2021-07-01

申请号：US17199180

申请日：2021-03-11

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Alexandre COULLOMB ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: H01L31/16

Abstract: A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.

公开(公告)号：US20200312735A1

公开(公告)日：2020-10-01

申请号：US16829210

申请日：2020-03-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Alexandre COULLOMB ,  Olivier FRANIATTE

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/373 ,  H01L23/49

Abstract: A substrate includes a through cavity. A heat sink is mounted so as to close one end of the through cavity. An integrated circuit (IC) chip is also mounted in the cavity. Conductive wires provide an electrical connection between pads on an upper surface of the IC chip and metallizations on the substrate. The mounted heat sink is positioned within the substrate in one implementation and positioned mounted to a back surface of the substrate in another implementation.

公开(公告)号：US20190355864A1

公开(公告)日：2019-11-21

申请号：US16409714

申请日：2019-05-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Alexandre COULLOMB ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: H01L31/16

Abstract: A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.