公开(公告)号：US20150103489A1

公开(公告)日：2015-04-16

申请号：US14512214

申请日：2014-10-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： David AUCHERE ,  Yvon IMBS

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K7/20 ,  H01L23/473 ,  H01L23/49816 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/73204 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/064 ,  H01L2924/00014

Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.

Abstract translation: 电子设备包括由绝缘材料制成并具有电连接网络的衬底晶片。 集成电路芯片安装在基板晶片的顶侧。 衬底晶片包含内部管道。 导管由位于基板晶片顶侧的覆盖沟槽形成。 沟槽包含导热材料，例如是流体。 偏离沟槽的衬底晶片顶部的开口允许在集成电路和电连接网络之间形成电连接。