公开(公告)号：US12114427B2

公开(公告)日：2024-10-08

申请号：US17831301

申请日：2022-06-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lung-Yuan Wang ,  Wen-Liang Lien

IPC: H05K3/32 ,  H01L23/31 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/144 ,  H01L23/3157 ,  H05K1/111 ,  H05K1/181 ,  H05K3/32 ,  H05K3/4682 ,  H05K1/0203 ,  H05K2201/042

Abstract: A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.

公开(公告)号：US12101879B2

公开(公告)日：2024-09-24

申请号：US18217958

申请日：2023-07-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K1/11 ,  H05K3/24

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/28 ,  H05K3/3452 ,  H05K1/111 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US12101878B2

公开(公告)日：2024-09-24

申请号：US17906214

申请日：2021-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hwa Lee ,  Yong Suk Kim

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/0275 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2201/09827

Abstract: A circuit board according to an embodiments includes an insulating portion comprising a plurality of insulating layers, wherein the insulating portion includes: a first insulating portion; a second insulating portion disposed on the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; and a third insulating portion disposed under the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; wherein the first insulating portion includes a prepreg including glass fibers, and wherein the second and third insulating portions include a resin coated copper (RCC) with a coefficient of thermal expansion in the range of 10 to 65 (10−6 m/m·k).

公开(公告)号：US20240314929A1

公开(公告)日：2024-09-19

申请号：US18588633

申请日：2024-02-27

Applicant: Kioxia Corporation

Inventor： Kiyokazu ISHIZAKI

IPC: H05K1/11 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H05K1/18

CPC classification number: H05K1/117 ,  H01L23/3128 ,  H01L23/49816 ,  H01L25/0652 ,  H05K1/111 ,  H05K1/181 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2225/06586 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/10734 ,  H05K2201/10984

Abstract: A semiconductor storage device includes a wiring pattern on an insulating base material; an insulating film covering partially the wiring pattern; and an electronic component. The wiring pattern includes a first pad having an edge in an arc shape, and a first wire. The insulating film has a first opening larger than the first pad. The first wire has a first portion, a second portion, and a third portion. The first portion is connected to the first pad inside the first opening extends in a first direction. The second portion is connected to the first pad inside the first opening and extends in a second direction. The third portion is connected to the first portion and the second portion. The first wire is connected with the first pad in an angular range of not more than 90 degrees in a circumferential direction of the first pad.

公开(公告)号：US20240306320A1

公开(公告)日：2024-09-12

申请号：US18408046

申请日：2024-01-09

Applicant: Samsung Display Co., LTD.

Inventor： SEON-KYONG KIM

IPC: H05K5/00 ,  H01L25/16 ,  H05K1/11

CPC classification number: H05K5/0069 ,  H05K1/111 ,  H01L25/162 ,  H01L25/167 ,  H05K2201/2036

Abstract: A display device includes a display panel including a display area, a pad area spaced apart from the display area, and a bending area adjacent to the display area in a first direction, disposed between the display area and the pad area, and bent from the display area, a window member disposed on a first surface of the display panel, and a spacer disposed on a second surface of the display panel opposite to the first surface and overlapping the display area and the pad area. A first opening pattern is defined at an end portion of the spacer.

公开(公告)号：US20240306292A1

公开(公告)日：2024-09-12

申请号：US18388302

申请日：2023-11-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyehwan Lee

IPC: H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K3/24 ,  H05K3/28

CPC classification number: H05K1/0306 ,  H05K1/056 ,  H05K1/111 ,  H05K3/244 ,  H05K3/287

Abstract: A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses. Each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.

公开(公告)号：US12089326B2

公开(公告)日：2024-09-10

申请号：US17741543

申请日：2022-05-11

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K1/118 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/10674

Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

公开(公告)号：US20240292529A1

公开(公告)日：2024-08-29

申请号：US18399156

申请日：2023-12-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Inhwan Oh ,  Sanghoon Kim ,  Chulmin Lee ,  Chanhoon Ko ,  Kyounghee Lim ,  Sohyun Bae

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/06

CPC classification number: H05K1/0298 ,  H05K1/111 ,  H05K3/06 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: The disclosed circuit board includes: a substrate portion that includes a first insulation layer and a first wiring layer buried by the first insulation layer, and a first element mounting portion and a second element mounting portion disposed on an upper surface of the substrate portion; a first protective layer disposed on the substrate portion; and an auxiliary layer that is disposed to overlap at least a part of a boundary area including a region between the first element mounting portion and the second element mounting portion, and has higher strength than the first protective layer.

公开(公告)号：US12075565B2

公开(公告)日：2024-08-27

申请号：US17222506

申请日：2021-04-05

Applicant: VueReal Inc.

Inventor： Gholamreza Chaji

IPC: H01L21/683 ,  H01L23/00 ,  H05K1/11 ,  H05K13/00 ,  H05K13/04 ,  G01R31/26 ,  H01L21/66 ,  H01L25/00

CPC classification number: H05K1/111 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H05K13/0015 ,  H05K13/0069 ,  H05K13/04 ,  G01R31/2635 ,  H01L22/14 ,  H01L22/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/75 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/27002 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29019 ,  H01L2224/29026 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/8314 ,  H01L2224/83141 ,  H01L2224/83143 ,  H01L2224/8316 ,  H01L2224/8318 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83234 ,  H01L2224/83238 ,  H01L2224/83862 ,  H01L2224/83902 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2224/83121 ,  H01L2924/00012 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/95 ,  H01L2224/27 ,  H01L2224/83862 ,  H01L2924/00014 ,  H01L2224/29026 ,  H01L2924/00012 ,  H01L2224/2919 ,  H01L2924/07802 ,  H01L2224/2919 ,  H01L2924/0781 ,  H01L2224/2732 ,  H01L2924/00014

Abstract: What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

公开(公告)号：US20240284594A1

公开(公告)日：2024-08-22

申请号：US18653496

申请日：2024-05-02

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han-Sung BAE ,  Wonkyu KWAK ,  Cheolgeun AN

IPC: H05K1/11 ,  G02F1/1345 ,  H01L23/00 ,  H01L23/495 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K1/118 ,  G02F1/13458 ,  H01L24/06 ,  H05K1/111 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/50

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.