公开(公告)号：US20020162677A1

公开(公告)日：2002-11-07

申请号：US10136682

申请日：2002-05-01

Applicant: STMICROELECTRONICS S.A.

Inventor： Pascale Mazoyer ,  Christian Caillat

IPC: H02G003/08

CPC classification number: H01L28/40 ,  H01L21/3144 ,  H01L23/5223 ,  H01L28/91 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated component, in which process and component a first electrode is in the form of a cup; a layer made of a dielectric covers at least the wall of the first electrode; a second electrode fills the cup; a first electrical connection via lies above the second electrode; and a second electrical connection via lies laterally with respect to and at a predetermined distance from the first electrode and is connected to the first electrode.

Abstract translation: 用于制造组件的方法，例如集成电路中的电容器和集成部件，其中第一电极是杯形式的工艺和部件; 由电介质覆盖的层至少覆盖第一电极的壁; 第二电极填充杯子; 第一电连接通孔位于第二电极上方; 并且第二电连接通孔相对于第一电极相对于并且距离第一电极具有预定距离横向延伸并且连接到第一电极。