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公开(公告)号:US10057684B2
公开(公告)日:2018-08-21
申请号:US15636423
申请日:2017-06-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Matteo Perletti , Stefano Losa , Lorenzo Tentori , Maria Carolina Turi
CPC classification number: H04R7/18 , B81B3/0054 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81C1/00158 , B81C2201/0132 , H04R19/005 , H04R19/04
Abstract: An electroacoustic MEMS transducer, having a substrate of semiconductor material; a through cavity in the substrate; a back plate carried by the substrate through a plate anchoring structure, the back plate having a surface facing the through cavity; a fixed electrode, extending over the surface of the back plate; a membrane of conductive material, having a central portion facing the fixed electrode and a peripheral portion fixed to the surface of the back plate through a membrane anchoring structure; and a chamber between the membrane and the back plate, peripherally delimited by the membrane anchoring structure.
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2.
公开(公告)号:US20180152788A1
公开(公告)日:2018-05-31
申请号:US15636423
申请日:2017-06-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Matteo Perletti , Stefano Losa , Lorenzo Tentori , Maria Carolina Turi
CPC classification number: H04R7/18 , B81B3/0054 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81C1/00158 , B81C2201/0132 , H04R19/005 , H04R19/04
Abstract: An electroacoustic MEMS transducer, having a substrate of semiconductor material; a through cavity in the substrate; a back plate carried by the substrate through a plate anchoring structure, the back plate having a surface facing the through cavity; a fixed electrode, extending over the surface of the back plate; a membrane of conductive material, having a central portion facing the fixed electrode and a peripheral portion fixed to the surface of the back plate through a membrane anchoring structure; and a chamber between the membrane and the back plate, peripherally delimited by the membrane anchoring structure.
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