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公开(公告)号：US20200319040A1
公开(公告)日：2020-10-08
申请号：US16904123
申请日：2020-06-17
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad ABBASI GAVARTI , Daniele CALTABIANO , Andrea PICCO , Anna Angela POMARICO , Giuditta ROSELLI , Francesco BRAGHIN
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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公开(公告)号：US20180306656A1
公开(公告)日：2018-10-25
申请号：US15957819
申请日：2018-04-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Elio GUIDETTI , Mohammad ABBASI GAVARTI , Daniele CALTABIANO , Gabriele BERTAGNOLI
CPC classification number: G01L1/18 , G01L5/162 , G01L25/00 , G01M5/0041 , G01M5/0083
Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.
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公开(公告)号：US20180238753A1
公开(公告)日：2018-08-23
申请号：US15894770
申请日：2018-02-12
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad ABBASI GAVARTI , Daniele CALTABIANO , Andrea PICCO , Anna Angela POMARICO , Giuditta ROSELLI , Francesco BRAGHIN
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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