公开(公告)号：US20180238753A1

公开(公告)日：2018-08-23

申请号：US15894770

申请日：2018-02-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mohammad ABBASI GAVARTI ,  Daniele CALTABIANO ,  Andrea PICCO ,  Anna Angela POMARICO ,  Giuditta ROSELLI ,  Francesco BRAGHIN

IPC: G01L1/18 ,  H01C10/10 ,  H01C17/00 ,  G01L9/06

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

公开(公告)号：US20190127214A1

公开(公告)日：2019-05-02

申请号：US16165828

申请日：2018-10-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario PACI ,  Marco FERRERA ,  Andrea PICCO

IPC: B81B3/00 ,  B81C1/00 ,  H01L41/09 ,  H01L25/16 ,  H01L41/31

Abstract: A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.

公开(公告)号：US20200319040A1

公开(公告)日：2020-10-08

申请号：US16904123

申请日：2020-06-17

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mohammad ABBASI GAVARTI ,  Daniele CALTABIANO ,  Andrea PICCO ,  Anna Angela POMARICO ,  Giuditta ROSELLI ,  Francesco BRAGHIN

IPC: G01L1/18 ,  G01L9/06 ,  G01L19/14 ,  G01L9/00 ,  G01L1/26 ,  H01C10/10 ,  H01C17/00

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.