INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM INCLUDING THE ELECTRONIC MODULE

    公开(公告)号:US20220099957A1

    公开(公告)日:2022-03-31

    申请号:US17480634

    申请日:2021-09-21

    Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

    ELECTRONIC MODULE CARRYING A PLURALITY OF ELECTRONIC DEVICES

    公开(公告)号:US20230171911A1

    公开(公告)日:2023-06-01

    申请号:US18056081

    申请日:2022-11-16

    CPC classification number: H05K7/1427

    Abstract: The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

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