公开(公告)号：US20180149538A1

公开(公告)日：2018-05-31

申请号：US15605559

申请日：2017-05-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alex GRITTI ,  Marco Omar GHIDONI

IPC: G01L19/00 ,  G01L19/14 ,  G01L9/08 ,  G01L11/06

CPC classification number: G01L19/0092 ,  G01L9/0045 ,  G01L9/0054 ,  G01L9/08 ,  G01L11/06 ,  G01L19/147 ,  G01L2019/0053 ,  H04R19/005 ,  H04R2201/003

Abstract: A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.

公开(公告)号：US20220238485A1

公开(公告)日：2022-07-28

申请号：US17580480

申请日：2022-01-20

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Dario PACI ,  Silvia ADORNO ,  Marco DEL SARTO ,  Fabrizio CERINI ,  Alex GRITTI

IPC: H01L25/065 ,  H01L23/64 ,  H01L23/00 ,  H01L23/538

Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.

公开(公告)号：US20210098355A1

公开(公告)日：2021-04-01

申请号：US16586643

申请日：2019-09-27

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Marco DEL SARTO ,  Alex GRITTI ,  Pierpaolo RECANATINI ,  Michael BORG

IPC: H01L23/498 ,  H01L23/31

Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.

公开(公告)号：US20220099957A1

公开(公告)日：2022-03-31

申请号：US17480634

申请日：2021-09-21

Applicant: STMicroelectronics S.r.l.

Inventor： Marco DEL SARTO ,  Alex GRITTI ,  Amedeo MAIERNA ,  Luca MAGGI

IPC: G02B26/08 ,  G02B26/10

Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

公开(公告)号：US20230171911A1

公开(公告)日：2023-06-01

申请号：US18056081

申请日：2022-11-16

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Luca MAGGI ,  Marco DEL SARTO ,  Alex GRITTI ,  Amedeo MAIERNA

IPC: H05K7/14

CPC classification number: H05K7/1427

Abstract: The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

公开(公告)号：US20170006368A1

公开(公告)日：2017-01-05

申请号：US15143207

申请日：2016-04-29

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto BRIOSCHI ,  Alex GRITTI ,  Kevin FORMOSA ,  Paul Anthony BARBARA

IPC: H04R1/04 ,  H04R19/04 ,  H04R31/00 ,  B81B7/00

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

Abstract translation: 微机电麦克风包括：基板; 传感器芯片，集成了微机电电声换能器; 以及可操作地耦合到所述传感器芯片的控制芯片。 在一个实施例中，传感器芯片和控制芯片被结合到基板，并且传感器芯片覆盖控制芯片或者至少部分覆盖在控制芯片上。 在另一个实施例中，传感器被结合到基板上，并且屏障位于传感器芯片的至少一部分周围。