公开(公告)号：US20230171911A1

公开(公告)日：2023-06-01

申请号：US18056081

申请日：2022-11-16

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Luca MAGGI ,  Marco DEL SARTO ,  Alex GRITTI ,  Amedeo MAIERNA

IPC: H05K7/14

CPC classification number: H05K7/1427

Abstract: The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

公开(公告)号：US20220099957A1

公开(公告)日：2022-03-31

申请号：US17480634

申请日：2021-09-21

Applicant: STMicroelectronics S.r.l.

Inventor： Marco DEL SARTO ,  Alex GRITTI ,  Amedeo MAIERNA ,  Luca MAGGI

IPC: G02B26/08 ,  G02B26/10

Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

公开(公告)号：US20180045885A1

公开(公告)日：2018-02-15

申请号：US15457637

申请日：2017-03-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Arturo Luigi CANALI ,  Luigi VERGA ,  Luca MAGGI

IPC: G02B6/12 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: G02B6/12002 ,  G02B2006/12147 ,  H01L23/5381 ,  H01L24/09 ,  H01L25/0657 ,  H01L25/167 ,  H01L25/50 ,  H01L27/14634 ,  H01L2224/0401 ,  H01L2224/09177 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/00

Abstract: A method of manufacturing semiconductor devices includes: coupling first and the second substrates by coupling a back surface of the second substrate with a front surface of the first substrate, thereby producing a step-like structure, with an uncovered portion of the front surface of the first substrate left uncovered by the second substrate coupling a first integrated circuit with the uncovered portion of the front surface of the first substrate; and coupling a second integrated circuit with the second substrate and the first integrated circuit by arranging the second integrated circuit extending bridge—like between the second substrate and the first integrated circuit.