公开(公告)号：US20230031569A1

公开(公告)日：2023-02-02

申请号：US17864217

申请日：2022-07-13

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Daniele CALTABIANO

IPC: G01S17/89 ,  G01S17/06 ,  G01S7/481

Abstract: An apparatus, comprising: a laser light source configured to transmit at least one beam of light pulses towards a target, projecting at least one corresponding beam spot thereon, and an array of sensors with a plurality of sensors distributed according to a grid, a sensor in the array of sensors configured to sense a light pulse incident thereon in response to reflection of at least one light pulse of the beam of light pulses from a field of view, FOV, region in the target, the sensor of the array of sensors further configured to provide a signal indicative of a time of incidence of at least one light pulse. A FOV region of the array of sensors is portioned into grid cells according to the grid. Each sensor in the array of sensors is configured to sense at least one echo light pulse reflected from a respective grid cell portion of the FOV region. The apparatus comprises a beam steering arrangement configured to cyclically vary a direction of transmission of the beam of light pulses, projecting at least one light pulse per grid cell in the portioned FOV region of the array of sensors.

公开(公告)号：US20200319040A1

公开(公告)日：2020-10-08

申请号：US16904123

申请日：2020-06-17

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mohammad ABBASI GAVARTI ,  Daniele CALTABIANO ,  Andrea PICCO ,  Anna Angela POMARICO ,  Giuditta ROSELLI ,  Francesco BRAGHIN

IPC: G01L1/18 ,  G01L9/06 ,  G01L19/14 ,  G01L9/00 ,  G01L1/26 ,  H01C10/10 ,  H01C17/00

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

公开(公告)号：US20180306656A1

公开(公告)日：2018-10-25

申请号：US15957819

申请日：2018-04-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Elio GUIDETTI ,  Mohammad ABBASI GAVARTI ,  Daniele CALTABIANO ,  Gabriele BERTAGNOLI

IPC: G01L1/18 ,  G01L25/00

CPC classification number: G01L1/18 ,  G01L5/162 ,  G01L25/00 ,  G01M5/0041 ,  G01M5/0083

Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.

公开(公告)号：US20180238753A1

公开(公告)日：2018-08-23

申请号：US15894770

申请日：2018-02-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mohammad ABBASI GAVARTI ,  Daniele CALTABIANO ,  Andrea PICCO ,  Anna Angela POMARICO ,  Giuditta ROSELLI ,  Francesco BRAGHIN

IPC: G01L1/18 ,  H01C10/10 ,  H01C17/00 ,  G01L9/06

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.