公开(公告)号：US20190244857A1

公开(公告)日：2019-08-08

申请号：US16384147

申请日：2019-04-15

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA

Inventor： Didier DUTARTRE ,  Jean-Pierre CARRERE ,  Jean-Luc HUGUENIN ,  Clement PRIBAT ,  Sarah KUSTER

IPC: H01L21/768 ,  H01L21/762 ,  H01L21/74 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/84 ,  H01L27/12

CPC classification number: H01L21/76877 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/743 ,  H01L21/7624 ,  H01L21/823475 ,  H01L21/84 ,  H01L27/1207 ,  H01L29/0649

Abstract: A silicon on insulator substrate includes a semiconductor bulk handle wafer, an insulating layer on said semiconductor bulk handle wafer and a semiconductor film on said insulating layer. An opening extends completely through the semiconductor film and insulating layer to expose a surface of the semiconductor bulk handle wafer. Epitaxial material fills the opening and extends on said semiconductor film, with the epitaxial material and semiconductor film forming a thick semiconductor film. A trench isolation surrounds a region of the thick semiconductor film to define an electrical contact made to the semiconductor bulk handle wafer through the opening.

公开(公告)号：US20210233811A1

公开(公告)日：2021-07-29

申请号：US17228164

申请日：2021-04-12

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Didier DUTARTRE ,  Jean-Pierre CARRERE ,  Jean-Luc HUGUENIN ,  Clement PRIBAT ,  Sarah KUSTER

IPC: H01L21/768 ,  H01L29/06 ,  H01L27/12 ,  H01L21/8234 ,  H01L21/84 ,  H01L21/762 ,  H01L21/74

Abstract: A silicon on insulator substrate includes a semiconductor bulk handle wafer, an insulating layer on said semiconductor bulk handle wafer and a semiconductor film on said insulating layer. An opening extends completely through the semiconductor film and insulating layer to expose a surface of the semiconductor bulk handle wafer. Epitaxial material fills the opening and extends on said semiconductor film, with the epitaxial material and semiconductor film forming a thick semiconductor film. A trench isolation surrounds a region of the thick semiconductor film to define an electrical contact made to the semiconductor bulk handle wafer through the opening.