公开(公告)号：US20240329098A1

公开(公告)日：2024-10-03

申请号：US18615233

申请日：2024-03-25

Applicant: STMicroelectronics International N.V.

Inventor： Roberto TIZIANI ,  Francesca DE VITI

IPC: G01R15/20 ,  G01R19/00 ,  H01L21/8234 ,  H01L23/31

CPC classification number: G01R15/207 ,  G01R15/202 ,  G01R19/0092 ,  H01L21/8234 ,  H01L23/3121

Abstract: An insulating encapsulation encapsulates a semiconductor die having an integrated Hall current sensor configured to measure an electric current flowing adjacent an active surface of the semiconductor die. An electrically conductive trace is embedded in the insulating encapsulation. First electrically conductive formations extend through the insulating encapsulation towards opposed ends of the electrically conductive trace. The first electrically conductive formations are configured to cause an electrical current subject to measurement to flow in a current flow path through the electrically conductive trace. Second electrically conductive formations extend through the insulating encapsulation towards the active surface of the semiconductor die. The second electrically conductive formations are configured to activate the Hall current sensor integrated in the semiconductor die.

公开(公告)号：US20240178178A1

公开(公告)日：2024-05-30

申请号：US18522909

申请日：2023-11-29

Applicant: STMicroelectronics International N.V.

Inventor： Francesca DE VITI ,  Damian HALICKI ,  Giovanni GRAZIOSI ,  Michele DERAI

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L24/24 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/25 ,  H01L25/16 ,  H01L2224/19 ,  H01L2224/24195 ,  H01L2224/2501 ,  H01L2924/1205

Abstract: An integrated circuit semiconductor dice has first and second opposed surfaces. First and second electrically conductive patterns extending at the first and second opposed surfaces provide electrical coupling to the semiconductor die. An electrical component, such as a capacitor, having a length transverse to the first and second opposed surfaces of the semiconductor die, extends bridge-like between the first and second opposed surfaces. Opposed electrical contact end terminals of the electrical component are coupled to the first and second electrically conductive patterns. The electrical component is thus electrically coupled to the semiconductor die via the first and second electrically conductive patterns at the first and second opposed surfaces.