公开(公告)号：US20240178178A1

公开(公告)日：2024-05-30

申请号：US18522909

申请日：2023-11-29

Applicant: STMicroelectronics International N.V.

Inventor： Francesca DE VITI ,  Damian HALICKI ,  Giovanni GRAZIOSI ,  Michele DERAI

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L24/24 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/25 ,  H01L25/16 ,  H01L2224/19 ,  H01L2224/24195 ,  H01L2224/2501 ,  H01L2924/1205

Abstract: An integrated circuit semiconductor dice has first and second opposed surfaces. First and second electrically conductive patterns extending at the first and second opposed surfaces provide electrical coupling to the semiconductor die. An electrical component, such as a capacitor, having a length transverse to the first and second opposed surfaces of the semiconductor die, extends bridge-like between the first and second opposed surfaces. Opposed electrical contact end terminals of the electrical component are coupled to the first and second electrically conductive patterns. The electrical component is thus electrically coupled to the semiconductor die via the first and second electrically conductive patterns at the first and second opposed surfaces.