公开(公告)号：US20240404963A1

公开(公告)日：2024-12-05

申请号：US18204092

申请日：2023-05-31

Applicant: STMicroelectronics International N.V.

Inventor： Jean-Michel RIVIERE

IPC: H01L23/00 ,  H01L23/36 ,  H01L23/498

Abstract: Systems, apparatuses, and methods for back-to-back (BTB) die for semiconductor packages are provided. For example, a semiconductor package may include a BTB die electrically coupled to a plurality of a Si blocks that may be positioned laterally from the BTB die. The semiconductor package may include a heat sink that is also electrically coupled to a plurality of Si blocks that may be positioned laterally from the BTB die. The Si blocks may be electrically coupled to terminals on a side of the semiconductor package. The Si blocks may provide for improved protection, thermal managements, and shielding.

公开(公告)号：US20240332210A1

公开(公告)日：2024-10-03

申请号：US18618447

申请日：2024-03-27

Applicant: STMicroelectronics International N.V.

Inventor： Patrick LAURENT ,  Jean-Michel RIVIERE

IPC: H01L23/552 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/16

CPC classification number: H01L23/552 ,  H01L31/02016 ,  H01L31/0203 ,  H01L31/16

Abstract: An integrated circuit optical package includes a support substrate having a mounting face and an electrical interconnection network between the mounting face and contact pads located on a lower face of the support substrate. A cap includes a lateral wall fastened on the mounting face and an upper wall including a first opening. A first optical element is fastened on the upper wall of the cap to seal the first opening. An electromagnetic shielding element is embedded in the cap and configured to be coupled to a reference supply point via the interconnection network and at least one contact pad. A first electronic chip is mounted on the mounting face and in optical cooperation with the first optical element.