公开(公告)号：US20240186195A1

公开(公告)日：2024-06-06

申请号：US18529064

申请日：2023-12-05

Applicant: STMicroelectronics International N.V.

Inventor： Laurent HERARD ,  Olivier ZANELLATO ,  Patrick LAURENT

IPC: H01L23/10 ,  H01L21/48 ,  H01L21/52 ,  H01L23/00 ,  H01L23/053 ,  H01L23/498

CPC classification number: H01L23/10 ,  H01L21/4846 ,  H01L21/52 ,  H01L23/053 ,  H01L23/49816 ,  H01L24/97 ,  H01L2224/97

Abstract: An integrated circuit package includes a support substrate having a mounting face and a lateral wall having an inner face and an outer face. The inner face delimits with the mounting face a cavity. The outer face includes a step extending outwardly of the package. An electronic chip disposed in the cavity and electrically connected to electrically-conductive contact pads. A sealing structure is bonded by a glue to an upper face of the lateral wall to seal the cavity. The glue does not spill out over the outer face of the lateral wall. Electrically-conductive connection elements are located over a lower face of the support substrate and electrically cooperate with the contact pads through an interconnection network located in the support substrate.

公开(公告)号：US20240332210A1

公开(公告)日：2024-10-03

申请号：US18618447

申请日：2024-03-27

Applicant: STMicroelectronics International N.V.

Inventor： Patrick LAURENT ,  Jean-Michel RIVIERE

IPC: H01L23/552 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/16

CPC classification number: H01L23/552 ,  H01L31/02016 ,  H01L31/0203 ,  H01L31/16

Abstract: An integrated circuit optical package includes a support substrate having a mounting face and an electrical interconnection network between the mounting face and contact pads located on a lower face of the support substrate. A cap includes a lateral wall fastened on the mounting face and an upper wall including a first opening. A first optical element is fastened on the upper wall of the cap to seal the first opening. An electromagnetic shielding element is embedded in the cap and configured to be coupled to a reference supply point via the interconnection network and at least one contact pad. A first electronic chip is mounted on the mounting face and in optical cooperation with the first optical element.