公开(公告)号：US20230402364A1

公开(公告)日：2023-12-14

申请号：US18451022

申请日：2023-08-16

Applicant: STMicroelectronics International N.V.

Inventor： Luca Maria Carlo DI DIO

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49872 ,  H01L23/49861 ,  H01L21/4846 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49586 ,  H01L23/49582

Abstract: A leadframe including a metal oxide layer on at least a portion of the leadframe are disclosed. More specifically, leadframes with a metal layer and a metal oxide layer formed on one or more leads before a tin finish plating layer is formed are described. The layers of metal and metal oxide between the one or more leads and the tin finish plating layer reduce the formation of tin whiskers, thus reducing the likelihood of shorting and improving the overall reliability of the package structure and device produced.

公开(公告)号：US20200211953A1

公开(公告)日：2020-07-02

申请号：US16726070

申请日：2019-12-23

Applicant: STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Luca Maria Carlo DI DIO

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: A leadframe including a metal oxide layer on at least a portion of the leadframe are disclosed. More specifically, leadframes with a metal layer and a metal oxide layer formed on one or more leads before a tin finish plating layer is formed are described. The layers of metal and metal oxide between the one or more leads and the tin finish plating layer reduce the formation of tin whiskers, thus reducing the likelihood of shorting and improving the overall reliability of the package structure and device produced.