公开(公告)号：US20240332106A1

公开(公告)日：2024-10-03

申请号：US18614989

申请日：2024-03-25

Applicant: STMicroelectronics International N.V.

Inventor： Paolo CREMA ,  Alberto ARRIGONI

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/495

CPC classification number: H01L23/3142 ,  H01L21/56 ,  H01L23/49503

Abstract: A semiconductor die is arranged at a first surface of a die pad. The die pad has a peripheral edge and a second surface opposite to the first surface that includes a first region and a second region surrounding the first region. The second region extends to the peripheral edge of the die pad from a border line at the first region and includes a recessed formation extending continuously along the border line. An insulating encapsulation is molded onto the die pad with the first region of the second surface left uncovered and the second region of the second surface of the die pad being covered by the insulating encapsulation that fills the recessed formation. The recessed formation has a variable recess depth between the border line and the peripheral edge of the die pad to provide an extended length delamination path from the border line to the semiconductor die.

公开(公告)号：US20210375787A1

公开(公告)日：2021-12-02

申请号：US17322712

申请日：2021-05-17

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Paolo CREMA ,  Jürgen BARTHELMES ,  Din-Ghee NEOH

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  C25D5/48 ,  H01L21/48 ,  C25D3/38 ,  C25D5/00 ,  C25D5/10

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.