公开(公告)号：US09337111B2

公开(公告)日：2016-05-10

申请号：US13853496

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Yohanes Bintang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/66 ,  H01L23/31

CPC classification number: H01L22/14 ,  H01L22/20 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/15311 ,  H01L2224/48227 ,  H01L2924/00012

Abstract: A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.

Abstract translation: 半导体封装包括位于第一管芯和附接到支撑衬底的第二管芯之间的RFID芯片。 RFID芯片没有与骰子和支撑基板的电连接。 RFID芯片的大小对应于插入板。 关于骰子的操作特性的数据在后端处理期间被存储到RFID芯片并从其读取，以确定异常并提高产量。 所述数据可以存储在与包装中的RFID芯片相对应的数据库中。 提供了一种制造具有位于晶片之间的RFID芯片的半导体封装的方法。 该包可以通过存储到RFID芯片和数据库的数据由客户追踪。

公开(公告)号：US20140291867A1

公开(公告)日：2014-10-02

申请号：US13853496

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Yohanes Bintang

IPC: H01L21/66 ,  H01L23/498

CPC classification number: H01L22/14 ,  H01L22/20 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/15311 ,  H01L2224/48227 ,  H01L2924/00012

Abstract: A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.

Abstract translation: 半导体封装包括位于第一管芯和附接到支撑衬底的第二管芯之间的RFID芯片。 RFID芯片没有与骰子和支撑基板的电连接。 RFID芯片的大小对应于插入板。 关于骰子的操作特性的数据在后端处理期间被存储到RFID芯片并从其读取，以确定异常并提高产量。 所述数据可以存储在与包装中的RFID芯片相对应的数据库中。 提供了一种制造具有位于晶片之间的RFID芯片的半导体封装的方法。 该包可以通过存储到RFID芯片和数据库的数据由客户追踪。