公开(公告)号：US20020130387A1

公开(公告)日：2002-09-19

申请号：US10055710

申请日：2002-01-22

Applicant: STMicroelectronics S.A.

Inventor： Jean-Francois Carpentier

IPC: H01L029/00

CPC classification number: H01L28/10 ,  H01F2017/0046 ,  H01F2021/125 ,  H01L27/08

Abstract: Semiconductor device comprising a metal circuit with two parts wound into spirals which are formed such that the branches of one of the parts and the corresponding branches of the other part lie on either side of a median longitudinal region and are symmetrical with respect to this region. A common junction connects the inner ends of the parts and lies across the median longitudinal region and the intermediate junctions between the branches of one of the parts pass above or below the intermediate junctions between the branches of the other part. A common external connection is connected to the common junction and separate external connection are connected respectively to the outer ends of the wound parts. The wound parts constitute two symmetrical metal windings formed between the common connection and the separate connection, respectively, and constituting symmetrical inductors.

Abstract translation: 半导体装置包括具有卷绕成螺旋形的两个部分的金属电路，其形成为使得其中一个部分的分支和另一部分的相应分支的分支位于中间纵向区域的两侧，并且相对于该区域是对称的。 公共接头连接部件的内端并跨越中间纵向区域，并且其中一个部件的分支之间的中间接合点通过另一部分的分支之间的中间接合点的上方或下方。 共同的外部连接连接到公共接头，分离的外部连接分别连接到伤口部分的外端。 绕线部分分别形成在公共连接和分离连接之间形成的对称金属绕组，并构成对称电感器。