公开(公告)号：US20040262721A1

公开(公告)日：2004-12-30

申请号：US10833883

申请日：2004-04-27

Applicant: STMicroelectronics S.r.I.

Inventor： Claudio Deodato ,  Roberto Tiziani

IPC: H01L021/48 ,  H01L023/495

CPC classification number: H01L21/4842 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A planar metallic foil is formed defining a lie plane which includes a supporting frame for a mount pad and corresponding leads being short-circuited to the mount pad. The mount pad is then down-set on a plane being parallel to the lie plane so as to keep at least a group of leads on the lie plane and separate by shearing the mount plane from the group of leads. A die is then mounted on a first surface of the mount pad. Electrical connections are then formed between the die and the group of leads. The frame is then encapsulated in a protective package so as to leave a second surface of the mount pad, being opposite to the first surface, exposed from the protective package.

Abstract translation: 形成平面金属箔，限定了一个平面，其包括用于安装垫的支撑框架，并且相应的引线被短路到安装垫。 然后将安装焊盘放置在平行于平面的平面上，以便在平面上保持至少一组引线，并通过将安装平面与引线组剪切分离。 然后将模具安装在安装垫的第一表面上。 然后在管芯和导线组之间形成电连接。 然后将框架封装在保护性封装中，以便从安全衬垫的第二表面离开第一表面，露出自保护封装。