Packaged sensor structure having sensor opening and package opening aligned with sensor element
    1.
    发明授权
    Packaged sensor structure having sensor opening and package opening aligned with sensor element 有权
    封装的传感器结构具有与传感器元件对准的传感器开口和封装开口

    公开(公告)号:US08847340B2

    公开(公告)日:2014-09-30

    申请号:US13907077

    申请日:2013-05-31

    Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.

    Abstract translation: 包括设置有至少一个通过开口的基板的电子设备,具有差分传感器的MEMS装置,其具有第一和第二表面,所述第一和第二表面具有至少一部分,其对于与第一和第二表面相对应地存在的流体的化学和/或物理变化敏感; 其第二相对的有效表面。 MEMS器件的第一表面离开暴露的第一有源表面,并且第二表面设置有暴露所述第二相对有效表面的另一开口,该电子器件的特征在于,MEMS器件的第一表面面向衬底,并且是 与其隔开预定距离,敏感部分与衬底的通过开口对准,并且其还包括至少部分地结合MEMS器件和衬底的保护封装。

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