公开(公告)号：US20130169302A1

公开(公告)日：2013-07-04

申请号：US13714553

申请日：2012-12-14

Applicant: STMicroelectronics S.r.I.

Inventor： Raffaele Ricci

IPC: G01R31/28

CPC classification number: G01R31/2887 ,  G01R31/2863 ,  H05K1/0268 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/10598

Abstract: High precision connectivity for a device under test (DUT) in an electronic test system at reduced cost and superior performance characteristics is provided by incorporating an appropriate contact structure into a printed circuit board (PCB) of the electronic test system. Alternatively, a superior adapter that is formed on the basis of highly precise volume production techniques, for example using well-established semiconductor materials and related manufacturing techniques, is provided to support high precision connectivity.

Abstract translation: 通过在电子测试系统的印刷电路板（PCB）中引入适当的接触结构，可以降低成本和优异的性能特性，为电子测试系统中被测设备（DUT）提供高精度连接。 或者，提供了基于高精度体积生产技术形成的优良适配器，例如使用已确立的半导体材料和相关制造技术，以支持高精度连接性。