公开(公告)号：US11951556B2

公开(公告)日：2024-04-09

申请号：US17732557

申请日：2022-04-29

Applicant: DTECH PRECISION INDUSTRIES CO., LTD.

Inventor： Ting-Jui Wang

IPC: B23K1/00 ,  F16B19/02 ,  H05K1/18 ,  B23K101/42

CPC classification number: B23K1/0008 ,  F16B19/02 ,  H05K1/181 ,  B23K2101/42 ,  H05K2201/10598

Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.

公开(公告)号：US20240074042A1

公开(公告)日：2024-02-29

申请号：US18494849

申请日：2023-10-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yulong Wu ,  Weiqiang Li

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K2201/044 ,  H05K2201/068 ,  H05K2201/10598

Abstract: The technology of this application relates to a circuit board assembly and an electronic device. The circuit board assembly is applied to the electronic device, and the circuit board assembly includes a circuit board carrying a large-sized chip and a substrate. The substrate is disposed on a side that is of the circuit board and that faces away from the chip, and is connected to the circuit board. In this application, a deformation manner of the circuit board assembly is designed, to effectively reduce impact of a stress generated by deformation of the substrate on self-deformation of the circuit board, and improve a long-term temperature cycle fatigue life of a solder joint between the chip and the circuit board.

公开(公告)号：US11728240B2

公开(公告)日：2023-08-15

申请号：US17392301

申请日：2021-08-03

Applicant: Vitesco Technologies GmbH

Inventor： Jens Reiter ,  Rico Hartmann ,  Christian Lammel

IPC: H01L23/40 ,  H05K1/18 ,  H01L25/11

CPC classification number: H01L23/4006 ,  H05K1/18 ,  H01L25/115 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K2201/09063 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10757

Abstract: A circuit carrier arrangement includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

公开(公告)号：US20190027846A1

公开(公告)日：2019-01-24

申请号：US15975174

申请日：2018-05-09

Applicant: Japan Aviation Electronics Industry, Limited

Inventor： Osamu HASHIGUCHI

IPC: H01R12/71 ,  H05K1/02

CPC classification number: H01R12/712 ,  H01R12/613 ,  H01R12/69 ,  H01R12/78 ,  H05K1/0277 ,  H05K1/147 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/10446 ,  H05K2201/10598 ,  H05K2203/167

Abstract: A connector includes a first connector portion in which projections project from a surface of a base plate, and a second connector portion formed of a fitting plate in which fitting holes corresponding to the projections are formed, at least either the projections or the fitting holes having elasticity, when the projections of the first connector portion are fitted in the fitting holes of the second connector portion as catching the first contact portion and the second contact portion with the first and second contact portions facing and being overlapped on each other, the first contact portion and the second contact portion being elastically pressed against each other and contacted to each other to establish electrical connection therebetween in a space between a lateral surface of the projections and an inner surface of the fitting holes.

公开(公告)号：US20180166815A1

公开(公告)日：2018-06-14

申请号：US15840161

申请日：2017-12-13

Applicant: HARTING ELECTRONICS GMBH

Inventor： Rainer Bussmann ,  Marc Lindkamp

IPC: H01R12/82 ,  H01R12/70 ,  H01R4/2429 ,  H01R12/67 ,  H01R9/03

CPC classification number: H01R12/82 ,  H01R4/2429 ,  H01R9/031 ,  H01R9/095 ,  H01R12/675 ,  H01R12/7094 ,  H01R12/716 ,  H01R13/4368 ,  H01R13/621 ,  H01R13/64 ,  H01R43/205 ,  H01R43/24 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A connector for installation on a printed circuit board a contacting part has which includes at least two contact elements, each of which can be connected, on the connection side, to an individual conductor and, on the plug-in side, to a conductive track of the printed circuit board, wherein the connector a connection part which encloses the individual conductors and, in the region of each individual conductor, has a recess, into each of which a contact element engages for the electrical connection between individual conductor and contact element. The contacting part is formed in an injection molding process, wherein at least two contact elements having an insulation-displacement connector are inserted or engaged in the contacting part or are directly encapsulated, and the connection part is formed in an injection molding process, wherein at least two individual conductors, each having a cable sheath, are thus placed in an injection molding tool and are encapsulated.

公开(公告)号：US20180082868A1

公开(公告)日：2018-03-22

申请号：US15659258

申请日：2017-07-25

Applicant: ALCATEL-LUCENT CANADA INC.

Inventor： Paul J. BROWN ,  Alex L. CHAN ,  Robert D'Amico

IPC: H01L21/67 ,  B23K3/06 ,  H05K3/32 ,  H01L21/50 ,  H05K3/34

CPC classification number: H01L21/67138 ,  B23K1/0016 ,  B23K3/0623 ,  B23K3/087 ,  B23K37/0443 ,  B23K2101/42 ,  H01L21/50 ,  H05K3/303 ,  H05K3/32 ,  H05K3/3436 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2203/0169 ,  Y02P70/613

Abstract: An apparatus configured to temporarily support a Ball Grid Array (BGA) component against a printed circuit board (PCB) during a manufacturing reflow operation, the apparatus including a support plate sized to fit over the BGA and having one or more mounting holes external to the periphery of the Ball Grid Array component, a retaining member for each mounting hole, passing through said mounting hole, a resilient biasing member for each retaining member, wherein the resilient biasing member urges the support plate against the BGA component from below the BGA component such that the BGA component is urged against the PCB.

公开(公告)号：US09844144B1

公开(公告)日：2017-12-12

申请号：US15231018

申请日：2016-08-08

Applicant: Intel Corporation

Inventor： Emad Al-Momani ,  Jack Mumbo ,  Srikanth Mothukuri

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10598 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: Apparatuses, systems and methods associated with electrical fast transient tolerant input/output (I/O) communication (e.g., universal serial bus (USB)) design are disclosed herein. In embodiments, an apparatus to mount an integrated circuit (IC) package, may include a printed circuit board (PCB), a plurality of pogo pins, and a mounting mechanism. The plurality of pogo pins may be mounted to electrical contacts of the PCB, the plurality of pogo pins may be coupled to the electrical contacts at first ends of the plurality of pogo pins and may be to couple to the IC package at second ends of the plurality of pogo pins. The mounting mechanism may position the IC package on the second ends of the plurality of pogo pins. Other embodiments may be described and/or claimed.

公开(公告)号：US09572244B1

公开(公告)日：2017-02-14

申请号：US14882390

申请日：2015-10-13

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10393 ,  H05K2201/10598

Abstract: A latch device for heat dissipation component includes a main body, a first and a second elastic member, a first and a second rotary unit. Two sides of the main body are respectively formed with a first and a second perforation. The first and second elastic members are fixedly disposed on one face of a motherboard. A first and a second hook/latch section respectively protrude from the first and the second elastic members corresponding to the first and second perforations. By means of a first and a second hook/latch member, the first and second rotary units are correspondingly hooked/latch with the first and second hook/latch sections. Then, the first and second rotary units are rotated to pull upward the first and second hook/latch members; further the first and second hook/latch sections can fix the main body. Hence, a user can assemble/detach the main body without using any hand tool.

Abstract translation: 用于散热部件的闩锁装置包括主体，第一和第二弹性部件，第一和第二旋转单元。 主体的两侧分别形成有第一和第二穿孔。 第一和第二弹性构件固定地设置在主板的一个面上。 第一和第二钩/闩锁部分分别从对应于第一和第二穿孔的第一和第二弹性部件伸出。 通过第一和第二钩/闩构件，第一和第二旋转单元相应地与第一和第二钩/闩锁部分钩挂/锁定。 然后，第一和第二旋转单元被旋转以向上拉第一和第二钩/闩构件; 此外，第一和第二钩/闩锁部分可以固定主体。 因此，用户可以在不使用任何手动工具的情况下组装/拆卸主体。

公开(公告)号：US09549464B2

公开(公告)日：2017-01-17

申请号：US14015938

申请日：2013-08-30

Applicant: Apple Inc.

Inventor： Shayan Malek ,  John B. Ardisana, II ,  Dhaval N. Shah

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K1/0284 ,  H05K1/115 ,  H05K1/141 ,  H05K3/36 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/061

Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

Abstract translation: 所描述的实施例通常涉及电子设备和用于增加与其相关联的电路板上的可用空间的三维模块。 在一些实施例中，模块可以具有长方体几何形状，并且可以包括多个表面，其具有被配置为互连布置在模块的各个表面上的电子部件的嵌入式电路迹线。 模块的一个表面可以包括至少一个通信接口，其被配置为将模块上的电路迹线互连到与模块耦合到的电路板上的相关联的电路路径。 在一些实施例中，该模块可以作为电路板和电子设备的另一个组件之间的间隔来操作。

公开(公告)号：US09414481B1

公开(公告)日：2016-08-09

申请号：US14677335

申请日：2015-04-02

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Wen-Ping Tu ,  Yu-Qing Lyu

IPC: H05K1/02 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K1/0203 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10598

Abstract: A heat sink fastener includes a heat sink assembly, a first stand, a second stand, a fastening plate, a fastening member, and a movable bar. The first stand includes a fastening portion. The second stand includes a restriction portion. The fastening plate is connected to the heat sink assembly. The fastening plate includes a hook portion, an extension portion, and a through hole. The hook portion is engaged with the fastening portion. The extension portion contacts with the restriction portion. The fastening member is inserted through the through hole and secured the second stand. The fastening member includes a bolt and a screw nail. The screw nail is provided with a pushing portion. The movable bar is connected to the second stand. The movable bar includes a pivot shaft, a restriction end restricting the pushing portion from movement, and a release end releasing the pushing portion to move.

Abstract translation: 散热器紧固件包括散热器组件，第一支架，第二支架，紧固板，紧固构件和可动杆。 第一支架包括紧固部分。 第二支架包括限制部分。 紧固板连接到散热器组件。 紧固板包括钩部，延伸部和通孔。 钩部与紧固部接合。 延伸部分与限制部分接触。 紧固构件穿过通孔插入并固定第二支架。 紧固构件包括螺栓和螺钉。 螺钉设有推动部。 可动杆连接到第二支架。 可动杆包括枢转轴，限制推动部分移动的限制端以及释放推动部分移动的释放端。