公开(公告)号：US20040157364A1

公开(公告)日：2004-08-12

申请号：US10746868

申请日：2003-12-24

Applicant: STMicroelectronics S.r.l.

Inventor： Chantal Combi ,  Benedetto Vigna

IPC: H01L021/44

CPC classification number: H01H59/0009

Abstract: The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.

Abstract translation: 微机电开关的制造方法包括在第一半导体基板上制造悬挂杆，第一半导体基板的一端配备有接触电极，以及从第一半导体基板突出的框架。 具有导电轨道的第二半导体衬底包括第二输入/输出电极和第三起始电极，以及电连接到导电轨道的第一和第二间隔件。 框架与第一间隔件邻接，使得第四接触电极响应于通过第三起动电极提供给吊杆的电信号而抵靠第二输入/输出电极。