公开(公告)号：US20230035470A1

公开(公告)日：2023-02-02

申请号：US17872774

申请日：2022-07-25

Applicant: STMicroelectronics S.r.l.

Inventor： Andrea ALBERTINETTI ,  Mirko ALESI

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: An encapsulation of laser direct structuring (LDS) material is molded onto a substrate having first and second semiconductor dice arranged thereon. Laser beam energy is applied to a surface of the encapsulation of LDS material to structure therein die vias extending through the LDS material to the first and second semiconductor dice and a die-to-die line extending at surface of the LDS material between die vias. Laser-induced forward transfer (LIFT) processing is applied to transfer electrically conductive material to the die vias and the die-to-die line extending between die vias. A layer of electrically conductive material electroless grown onto the die vias and the die-to-die line facilitates improved adhesion of the electrically conductive material transferred via LIFT processing.

公开(公告)号：US20230032786A1

公开(公告)日：2023-02-02

申请号：US17873749

申请日：2022-07-26

Applicant: STMicroelectronics S.r.l.

Inventor： Matteo DE SANTA ,  Mirko ALESI

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

Abstract: A leadframe includes a die pad having arranged thereon a first semiconductor die with an electrically conductive ribbon extending on the first semiconductor die. The first semiconductor die lies intermediate the leadframe and the electrically conductive ribbon. A second semiconductor die is mounted on the electrically conductive ribbon to provide, on the same die pad, a stacked arrangement of the second semiconductor die and the first semiconductor die with the at least one electrically conductive ribbon intermediate the first semiconductor die and the second semiconductor die. Package size reduction can thus be achieved without appreciably affecting the assembly flow of the device.