公开(公告)号：US20180299337A1

公开(公告)日：2018-10-18

申请号：US15958461

申请日：2018-04-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo BALDO ,  Sarah ZERBINI ,  Enri DUQI

IPC: G01L9/00 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116 ,  G01L9/0072

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate made of polysilicon, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.

公开(公告)号：US20230083632A1

公开(公告)日：2023-03-16

申请号：US18056203

申请日：2022-11-16

Applicant: STMicroelectronics S.r.l.

Inventor： Francesco RIZZINI ,  Gabriele GATTERE ,  Sarah ZERBINI

IPC: G01P15/03 ,  B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/18

Abstract: A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary stopper element and one secondary stopper element. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

公开(公告)号：US20170284882A1

公开(公告)日：2017-10-05

申请号：US15276617

申请日：2016-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo BALDO ,  Sarah ZERBINI ,  Enri DUQI

IPC: G01L9/00 ,  B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.