公开(公告)号：US20030234446A1

公开(公告)日：2003-12-25

申请号：US10371397

申请日：2003-02-20

Applicant: STMicroelectronics SA

Inventor： Jean-Luc Diot ,  Christophe Prior ,  Jerome Teysseyre ,  Jean-Pierre Moscicki

IPC: H01L023/48 ,  H01L023/28 ,  H01L021/44

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

Abstract translation: 引线框架具有在中心平台和位于一定距离之间的周边部分之间形成穿孔，辐射细长的引线。 所述引线框在其与所述模具的支承表面接触的后表面上具有至少一个凹部和用于将所述凹部连接到所述穿孔的凹槽。