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公开(公告)号:US20180331427A1
公开(公告)日:2018-11-15
申请号:US16041382
申请日:2018-07-20
申请人: Fractus, S.A.
IPC分类号: H01Q9/04 , H01Q9/40 , H01Q9/42 , H01Q13/10 , H01L25/16 , H01Q1/22 , H01L23/66 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q9/26 , H01L23/00
CPC分类号: H01Q9/045 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/165 , H01L2223/6677 , H01L2224/05599 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2224/48464 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/207 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01Q1/22 , H01Q1/2283 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q9/26 , H01Q9/30 , H01Q9/40 , H01Q9/42 , H01Q13/10
摘要: The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna, each of the five sections or segments forming a pair of angles with each adjacent segment or section, wherein the smaller angle of each of the four pairs of angles between sections or segments is less than 180° (i.e., no pair of sections or segments define a longer straight segment), wherein at least two of the angles are less than 115°, wherein at least two of the angles are not equal, and wherein the curve fits inside a rectangular area the longest edge of which is shorter than one-fifth of the longest free-space operating wavelength of the antenna.
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2.
公开(公告)号:US10074599B2
公开(公告)日:2018-09-11
申请号:US15620191
申请日:2017-06-12
发明人: Chua Swee Kwang , Yong Poo Chia
IPC分类号: H01L23/495 , H01L23/00 , H01L23/047 , H01L21/48 , H01L23/31
CPC分类号: H01L23/49575 , H01L21/4821 , H01L21/4825 , H01L21/4839 , H01L23/047 , H01L23/3114 , H01L23/49503 , H01L23/4951 , H01L24/32 , H01L24/48 , H01L29/0657 , H01L2224/05599 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/207 , H01L2924/00012 , H01L2224/85399
摘要: Semiconductor dies with recesses, associated leadframes, and associated systems and methods are disclosed. A semiconductor system in accordance with one embodiment includes a semiconductor die having a first surface and a second surface facing opposite from the first surface, with the first surface having a die recess. The system can further include a support paddle carrying the semiconductor die, with at least part of the support paddle being received in the die recess. In particular embodiments, the support paddle can form a portion of a leadframe. In other particular embodiments, the support paddle can include a paddle surface that faces toward the semiconductor die and has an opening extending through the paddle surface and through the support paddle.
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3.
公开(公告)号:US20180240785A1
公开(公告)日:2018-08-23
申请号:US15960960
申请日:2018-04-24
发明人: Seng Kim Ye , Hong Wan Ng
CPC分类号: H01L25/0657 , H01L21/78 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L25/18 , H01L25/50 , H01L2224/05554 , H01L2224/05599 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/8385 , H01L2224/85399 , H01L2224/8592 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06582 , H01L2225/06593 , H01L2924/00014 , H01L2924/1205 , H01L2924/143 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/207 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2924/0665
摘要: Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.
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公开(公告)号:US10037965B2
公开(公告)日:2018-07-31
申请号:US15298743
申请日:2016-10-20
发明人: Leo M. Higgins, III
CPC分类号: H01L24/49 , H01L21/56 , H01L23/295 , H01L23/3135 , H01L23/3192 , H01L23/562 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05124 , H01L2224/05553 , H01L2224/05567 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48799 , H01L2224/48992 , H01L2224/49175 , H01L2224/85205 , H01L2224/85399 , H01L2224/854 , H01L2224/8592 , H01L2924/00014 , H01L2924/01001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0549 , H01L2924/181 , H01L2924/186 , H01L2924/3025 , H01L2924/0001 , H01L2224/48824 , H01L2924/00 , H01L2224/05552 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/00015 , H01L2924/207
摘要: A semiconductor device includes a plurality of wire bonds formed on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; a protective material is applied around the plurality of wire bonds, the protective material having a first pH; and at least a portion of the semiconductor device and the protective material are encapsulated with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
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5.
公开(公告)号:US10002843B2
公开(公告)日:2018-06-19
申请号:US14667317
申请日:2015-03-24
发明人: Tien-Szu Chen , Kuang-Hsiung Chen , Sheng-Ming Wang , Yu-Ying Lee
CPC分类号: H01L24/17 , H01L21/4853 , H01L21/4857 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L23/49822 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/16225 , H01L2224/16258 , H01L2224/17106 , H01L2224/32225 , H01L2224/48091 , H01L2224/48101 , H01L2224/48227 , H01L2224/48228 , H01L2224/48245 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/0665 , H01L2924/1511 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/1579 , H01L2924/181 , H05K1/111 , H05K3/10 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/05599 , H01L2224/85399
摘要: The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate structure includes a conductive structure and a dielectric structure. The conductive structure has a first conductive surface and a second conductive surface opposite to the first conductive surface. The dielectric structure covers at least a portion of the conductive structure, and has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The first conductive surface does not protrude from the first dielectric surface, and the second conductive surface is recessed from the second dielectric surface. The dielectric structure includes, or is formed from, a photo-sensitive resin, and the dielectric structure defines a dielectric opening in the second dielectric surface to expose a portion of the second conductive surface.
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公开(公告)号:US10002811B2
公开(公告)日:2018-06-19
申请号:US15647542
申请日:2017-07-12
发明人: Young Gwan Ko , Sung Won Jeong
IPC分类号: H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/66 , H01L23/00 , H01L21/56 , H01L23/31 , H01L23/522
CPC分类号: H01L22/34 , H01L21/56 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L22/14 , H01L23/28 , H01L23/295 , H01L23/3128 , H01L23/3178 , H01L23/49827 , H01L23/5226 , H01L23/5389 , H01L24/00 , H01L24/48 , H01L24/85 , H01L25/105 , H01L2221/68345 , H01L2224/0401 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81192 , H01L2224/83005 , H01L2224/92125 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/1432 , H01L2924/15192 , H01L2924/1533 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要: An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a through hole accommodating the electronic component, an adhesive layer bonding the wiring part and the frame to each other, and an encapsulant filling at least a portion of the through hole.
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公开(公告)号:US09991229B2
公开(公告)日:2018-06-05
申请号:US14820282
申请日:2015-08-06
发明人: Yoshihiko Shimanuki
IPC分类号: H01R9/00 , H01L25/065 , H01L23/00 , H01L23/498 , H01L23/31
CPC分类号: H01L24/85 , H01L21/561 , H01L21/6835 , H01L23/3128 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/97 , H01L25/0657 , H01L2221/68331 , H01L2223/5442 , H01L2223/54486 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/48599 , H01L2224/4911 , H01L2224/49171 , H01L2224/49429 , H01L2224/73265 , H01L2224/78301 , H01L2224/78302 , H01L2224/85001 , H01L2224/85009 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85205 , H01L2224/85986 , H01L2224/92 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2924/00011 , H01L2924/00014 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/01079 , H01L2224/85 , H01L2224/83 , H01L2924/01013 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/01006 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要: A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of the semiconductor chip and the bonding leads of the substrate, a sealing body for resin sealing the semiconductor chip and the wires, and solder bumps disposed on the back surface of the package substrate. The top of a loop of each of the wires is disposed outside the wire connecting portion so that the wire connection between the bonding leads and the pads of the semiconductor chip has a stable loop shape to prevent wire connection failure.
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公开(公告)号:US09991225B2
公开(公告)日:2018-06-05
申请号:US14747169
申请日:2015-06-23
发明人: Sandeep R. Bahl , Michael D. Seeman
IPC分类号: H01L29/66 , H01L23/00 , H01L27/085 , H01L29/78 , H01L29/40 , H01L29/778 , H01L21/8258 , H01L27/088 , H01L29/20
CPC分类号: H01L24/97 , H01L21/8258 , H01L24/48 , H01L27/085 , H01L27/088 , H01L29/2003 , H01L29/404 , H01L29/7786 , H01L29/78 , H01L2224/48137 , H01L2924/00014 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要: A high-voltage transistor (HVT) structure adapts a low-voltage transistor (LVT) to high-voltage environments. The HVT structure includes a drain node, a source node, a control gate, and a field electrode. The drain node and the source node define a conductive channel, in which mobilized charges are regulated by the control gate. While being isolated from the control gate, the field electrode is configured to spread the mobilized charges in response to a field voltage. The field electrode is structured and routed to prevent charge sharing with any one of the drain node, source node, or control gate. Advantageously, the isolated field electrode minimizes the capacitance of the control gate as well as the drain and source nodes, such that the HVT can switch with less power loss and a more robust performance in a high-voltage environment.
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公开(公告)号:US09991209B2
公开(公告)日:2018-06-05
申请号:US15034679
申请日:2014-10-07
申请人: THALES SOLUTIONS ASIA PTE LTD. , CNRS—CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (EPST) , NANYANG TECHNOLOGICAL UNIVERSITY
发明人: Dunlin Tan , Jong Jen Yu , David Hee , Beng Kang Tay , Dominique Baillargeat
IPC分类号: H01L23/552 , B82Y10/00 , H01L23/498 , H01L23/66 , H01L25/065 , H01L25/16 , H01L29/41 , H05K9/00 , H01L23/367 , H01L23/373 , H01L23/538 , H01L23/04 , H01L23/00 , H01L29/06
CPC分类号: H01L23/552 , B82Y10/00 , H01L23/04 , H01L23/3677 , H01L23/373 , H01L23/49827 , H01L23/49838 , H01L23/49877 , H01L23/5384 , H01L23/5385 , H01L23/66 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/16 , H01L29/0676 , H01L29/413 , H01L2223/6616 , H01L2223/6683 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32165 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/01006 , H01L2924/14 , H01L2924/1421 , H01L2924/1423 , H01L2924/157 , H01L2924/3025 , H05K9/0022 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
摘要: A method of fabricating an electrical guard structure for providing signal isolation is provided. The method includes providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component. The method further comprises synthesizing a plurality of thread-like structures over the substrate to collectively form one or more electrically conductive projections extending transverse to the mounting surface. The one or more electrically conductive projections include one or more wall-like structures which are elongate parallel to the mounting surface. The electrically conductive projections can be transferred to another surface such as a major surface of a second substrate. There are further provided a support structure and a guard structure having the wall-like electrically conductive projections which are electrically grounded when in use to provide signal isolation.
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公开(公告)号:US09979441B2
公开(公告)日:2018-05-22
申请号:US12737025
申请日:2009-06-01
申请人: Tadahiro Kuroda
发明人: Tadahiro Kuroda
IPC分类号: H04B5/00 , H04B5/02 , H02J50/10 , H01L23/48 , H01L23/522 , H01L23/00 , H01L25/065
CPC分类号: H04B5/02 , H01L23/48 , H01L23/5227 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2223/6677 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/4911 , H01L2224/73265 , H01L2224/85399 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H02J50/10 , H04B5/0093 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: An electronic circuit carries out communication by inductive coupling between chips which are stacked and mounted. The electronic circuit relays an inter-chip communication signal by a repeater which receives a signal from a transmitter to recognize a transmission source and a receiving destination, and relays a received signal when the repeater itself exists between the transmission source and the receiving destination, and does not relay the received signal when the repeater itself does not exist between the transmission source and the receiving destination. Accordingly, data can be transferred at high speed up to a chip farther than the dimensions of a coil through communications by inductive coupling between the stacked and mounted chips.
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