公开(公告)号：US20240090240A1

公开(公告)日：2024-03-14

申请号：US18367704

申请日：2023-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： TAKUYA FUTATSUYAMA ,  Daeseok Byeon ,  Gyosoo Choo

IPC: H10B80/00 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H10B80/00 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/08145 ,  H01L2224/80006 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2924/1431 ,  H01L2924/14511

Abstract: An integrated circuit (IC) device includes a peripheral circuit structure and cell array structure. The peripheral circuit structure includes a circuit substrate, a peripheral circuit, a first insulating layer covering the circuit substrate and the peripheral circuit, and a first bonding pad. The cell array structure includes an insulating structure having first and second surfaces opposing each other, a conductive plate on the first surface, a memory cell array on the conductive plate, a second insulating layer, a second bonding pad disposed on the second insulating layer, first and second wiring lines spaced apart from each other on the second surface, a conductive via passing through the insulating structure and connecting the conductive plate to the first wiring line, and a contact structure electrically connecting the first wiring line to the second bonding pad. The first bonding pad is in contact with the second bonding pad.