公开(公告)号：US11567357B2

公开(公告)日：2023-01-31

申请号：US16857872

申请日：2020-04-24

Applicant: Samsung Display Co., LTD.

Inventor： Myong-Soo Oh ,  Minsung Kim ,  Heejong Shin ,  Juno Song

IPC: G02F1/1335 ,  G02F1/1345 ,  H01L51/52

Abstract: A display device may include a display panel including an active area displaying an image and a peripheral area surrounding the active area, pad parts disposed on a side surface of the display panel, a light blocking layer disposed on a portion of the peripheral area adjacent to the side surface of the display panel, and circuit units electrically connected to the pad parts.

公开(公告)号：US12078885B2

公开(公告)日：2024-09-03

申请号：US18091705

申请日：2022-12-30

Applicant: Samsung Display Co., LTD.

Inventor： Myong-Soo Oh ,  Minsung Kim ,  Heejong Shin ,  Juno Song

IPC: G02F1/1335 ,  G02F1/1345 ,  H10K50/86

CPC classification number: G02F1/133512 ,  G02F1/133528 ,  G02F1/13452 ,  G02F1/13458 ,  H10K50/865 ,  G02F1/133531

Abstract: A display device may include a display panel including an active area displaying an image and a peripheral area surrounding the active area, pad parts disposed on a side surface of the display panel, a light blocking layer disposed on a portion of the peripheral area adjacent to the side surface of the display panel, and circuit units electrically connected to the pad parts.

公开(公告)号：US12002744B2

公开(公告)日：2024-06-04

申请号：US17356899

申请日：2021-06-24

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Myong-Soo Oh ,  Minsung Kim ,  Juno Song ,  Heejong Shin

IPC: H01L25/18 ,  G09G3/3241 ,  H01L21/48 ,  H01L21/66 ,  H01L23/498 ,  H01L23/544 ,  H10K59/131

CPC classification number: H01L23/49838 ,  G09G3/3241 ,  H01L21/4803 ,  H01L22/20 ,  H01L23/4985 ,  H01L23/544 ,  G09G2310/0243 ,  G09G2330/02 ,  H01L25/18 ,  H10K59/131

Abstract: A film package includes a base substrate having a bottom surface that includes a first portion and a second portion that are spaced apart from each other. First pad wires are disposed on the first portion of the bottom surface of the base substrate. Second pad wires are disposed on the second portion of the bottom surface of the base substrate. A light blocking member is disposed between the first pad wires and the second pad wires.