公开(公告)号：US20240339576A1

公开(公告)日：2024-10-10

申请号：US18417997

申请日：2024-01-19

Applicant: Samsung Display Co., Ltd.

Inventor： MYONGHOON ROH ,  EUI JEONG KANG ,  HANHO PARK ,  DAEGEUN LEE ,  JOONGMOK LEE ,  EUNJEONG JEON

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: A circuit board includes a plurality of insulating layers, at least one conductive layer disposed between the plurality of insulating layers, a connection pad disposed under the conductive layer, a signal line disposed under the conductive layer and electrically connected to the connection pad, and a protective layer disposed under the conductive layer and having a lower surface positioned in a same plane as a lower surface of the connection pad.