公开(公告)号：US11758785B2

公开(公告)日：2023-09-12

申请号：US17380074

申请日：2021-07-20

Applicant: Samsung Display Co., Ltd.

Inventor： Cheolhwan Eom ,  Kwang-Min Kim ,  Hyeaweon Shin ,  Sang Joon Ryu ,  Hyungjun An ,  Minji Lee ,  Yul Kyu Lee ,  Jeahyun Lee

IPC: H10K59/35 ,  H10K59/131 ,  H01L23/31 ,  H01L23/538 ,  G09G3/3258

CPC classification number: H10K59/35 ,  G09G3/3258 ,  H01L23/3114 ,  H01L23/5384 ,  H10K59/131 ,  G09G2300/0804

Abstract: A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a first pad and a second pad on the pad area of the substrate, and a chip-on-film package over the pad area of the substrate with the first pad and the second pad in between, the chip-on-film package including an insulation layer, a first wiring on an upper surface of the insulation layer and electrically connected to the first pad, and a second wiring on a lower surface of the insulation layer and electrically connected to the second pad. A first signal having alternating voltage levels may be applied to the first wiring, and a second signal having a constant voltage level may be applied to the second wiring.

公开(公告)号：US11449160B2

公开(公告)日：2022-09-20

申请号：US16848740

申请日：2020-04-14

Applicant: Samsung Display Co., Ltd.

Inventor： Youngeun Nam ,  JongWon Moon ,  Hyeaweon Shin ,  Cheolhwan Eom

IPC: G06F3/041 ,  H05K1/14 ,  H05K3/36 ,  H05K1/02

Abstract: An input sensing device includes an input sensing panel, a flexible circuit board connected to a first side of the input sensing panel, a first lower protective film below the input sensing panel, a second lower protective film below the first lower protective film, and a reinforcing member between a lower portion of the flexible circuit board and a second side of the input sensing panel that is adjacent to the first side, the reinforcing member covering a portion of the lower portion of the flexible circuit board. A side facing the reinforcing member of any one of the first lower protective film and the second lower protective film is spaced from the reinforcing member.

公开(公告)号：US11101329B2

公开(公告)日：2021-08-24

申请号：US16899698

申请日：2020-06-12

Applicant: Samsung Display Co., Ltd.

Inventor： Cheolhwan Eom ,  Kwang-Min Kim ,  Hyeaweon Shin ,  Sang Joon Ryu ,  Hyungjun An ,  Minji Lee ,  Yul Kyu Lee ,  Jeahyun Lee

IPC: H01L27/32 ,  H01L23/31 ,  H01L23/538 ,  G09G3/3258

Abstract: A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a first pad and a second pad on the pad area of the substrate, and a chip-on-film package over the pad area of the substrate with the first pad and the second pad in between, the chip-on-film package including an insulation layer, a first wiring on an upper surface of the insulation layer and electrically connected to the first pad, and a second wiring on a lower surface of the insulation layer and electrically connected to the second pad. A first signal having alternating voltage levels may be applied to the first wiring, and a second signal having a constant voltage level may be applied to the second wiring.

公开(公告)号：US10686017B2

公开(公告)日：2020-06-16

申请号：US16259523

申请日：2019-01-28

Applicant: Samsung Display Co., Ltd.

Inventor： Cheolhwan Eom ,  Kwang-Min Kim ,  Hyeaweon Shin ,  Sang Joon Ryu ,  Hyungjun An ,  Minji Lee ,  Yul Kyu Lee ,  Jeahyun Lee

IPC: H01L27/32 ,  G09G3/3258 ,  H01L23/31 ,  H01L23/538

Abstract: A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a first pad and a second pad on the pad area of the substrate, and a chip-on-film package over the pad area of the substrate with the first pad and the second pad in between, the chip-on-film package including an insulation layer, a first wiring on an upper surface of the insulation layer and electrically connected to the first pad, and a second wiring on a lower surface of the insulation layer and electrically connected to the second pad. A first signal having alternating voltage levels may be applied to the first wiring, and a second signal having a constant voltage level may be applied to the second wiring.