公开(公告)号：US09954008B2

公开(公告)日：2018-04-24

申请号：US15006259

申请日：2016-01-26

Applicant: Samsung Display Co., Ltd.

Inventor： Jun-hee Lee ,  Eoksu Kim ,  Wonjin Kim ,  Juyong Park ,  Jungchul Woo ,  Hyunwook Lee

IPC: G02F1/13 ,  H01L27/12 ,  G02F1/1333 ,  G02F1/1341 ,  G02F1/1339 ,  G09G3/00 ,  G02F1/1362

CPC classification number: H01L27/124 ,  G02F1/1309 ,  G02F1/133351 ,  G02F1/1339 ,  G02F1/1341 ,  G02F2001/13415 ,  G02F2001/136254 ,  G02F2201/56 ,  G02F2203/69 ,  G09G3/006 ,  G09G2330/12 ,  H01L27/1218

Abstract: A liquid crystal cell panel includes a first substrate from which is formed a thin film transistor array substrate, the first substrate including a plurality of unit cells and test terminals which respectively correspond to the unit cells, and a second substrate which faces the first substrate and from which is formed a color filter substrate. The first substrate further includes a first cutting pattern at each of a plurality of corners thereof, and the second substrate includes a second cutting pattern at each of a plurality of corners thereof, the second cutting patterns corresponding one-to-one with the first cutting patterns. Corresponding first and second cutting patterns cross each other in a plan view, and the crossing first and second cutting patterns expose a test terminal adjacent to the crossing first and second cutting patterns to outside the liquid crystal cell panel.

公开(公告)号：US10716221B2

公开(公告)日：2020-07-14

申请号：US15449697

申请日：2017-03-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jun-hee Lee ,  Sang-hoon Back ,  Daeho Yang ,  Seungjoo Lee ,  Myung-gil Choi ,  Taeyoung Park

IPC: H05K3/36 ,  G02F1/1345 ,  H05K1/14 ,  H05K13/00

Abstract: Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.