公开(公告)号：US10716221B2

公开(公告)日：2020-07-14

申请号：US15449697

申请日：2017-03-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jun-hee Lee ,  Sang-hoon Back ,  Daeho Yang ,  Seungjoo Lee ,  Myung-gil Choi ,  Taeyoung Park

IPC: H05K3/36 ,  G02F1/1345 ,  H05K1/14 ,  H05K13/00

Abstract: Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.