公开(公告)号：US20240011154A1

公开(公告)日：2024-01-11

申请号：US18125435

申请日：2023-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： HYUNJU LEE ,  BYEONGHOON KIM ,  HYOUNCHEOL KIM ,  JAEHYUNG LEE ,  BYUNGHWAN KONG

IPC: C23C16/455 ,  H01L21/673 ,  C23C16/458 ,  C23C16/46

CPC classification number: C23C16/45502 ,  H01L21/6732 ,  C23C16/4583 ,  C23C16/46

Abstract: A substrate processing apparatus may include an inner tube providing a process space extending vertically, an outer tube enclosing the inner tube, a gas supplying conduit connected to the process space, and a boat configured to be disposed in the process space. A first inner diameter of the inner tube at a first position may be different from a second inner diameter of the inner tube at a second position, and a level of the second position may be higher than a level of the first position.