公开(公告)号：US20240170459A1

公开(公告)日：2024-05-23

申请号：US18502569

申请日：2023-11-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo Hee HWANG ,  Young Kun JEE ,  Sang Cheon PARK

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/1436 ,  H10B80/00

Abstract: A semiconductor package may include a package substrate, a stack die including a plurality of dies are stacked on the package substrate, a gap fill insulating layer on an upper surface of the stack die, a top dummy die on the gap fill insulating layer, and a molding portion surrounding the stack die having the top dummy die thereon.