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1.发明授权公开(公告)号：US11921419B2
公开(公告)日：2024-03-05
申请号：US17382773
申请日：2021-07-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sooyong Lee , Bong-Soo Kang
IPC: G03F1/36 , H01L21/8234
CPC classification number: G03F1/36 , H01L21/823487
Abstract: A method of fabricating a semiconductor device includes performing an optical proximity correction (OPC) operation on a design pattern of a layout, and forming a photoresist pattern on a substrate, using a photomask which is manufactured with the layout corrected by the OPC operation. The OPC operation includes generating a target pattern based on the design pattern, performing a first OPC operation, based on the target pattern, to generate a first correction pattern, measuring a target error by comparing a first simulation image of the first correction pattern with the target pattern, generating a retarget pattern from the target pattern, based on the target error, and performing a second OPC operation, based on the retarget pattern, to generate a second correction pattern.
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公开(公告)号：US10403962B2
公开(公告)日：2019-09-03
申请号：US15775545
申请日：2016-11-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hwan Yeom , Bong-Soo Kang , Dae-Hun Jung
Abstract: An electronic device according to various embodiments is provided and includes a conductive inner module in which a plurality of layers are stacked; an electrical opening formed in at least a portion of the rim of the conductive inner module when stacking the plurality of layers; and an antenna module disposed at the periphery of the electrical opening, wherein the antenna module may include a feeding part formed on at least one of a plurality of layers forming the conductive inner module, and a conductive pattern which is connected to the feeding part and disposed circumferencing at least one of the electrical openings.
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公开(公告)号：US10454154B2
公开(公告)日：2019-10-22
申请号：US15775545
申请日：2016-11-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hwan Yeom , Bong-Soo Kang , Dae-Hun Jung
Abstract: An electronic device according to various embodiments is provided and includes a conductive inner module in which a plurality of layers are stacked; an electrical opening formed in at least a portion of the rim of the conductive inner module when stacking the plurality of layers; and an antenna module disposed at the periphery of the electrical opening, wherein the antenna module may include a feeding part formed on at least one of a plurality of layers forming the conductive inner module, and a conductive pattern which is connected to the feeding part and disposed circumferencing at least one of the electrical openings.
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